With the measurement of heart rate in wearable devices continuing to be refined for even greater precision
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On the heels of announcing its 1-gamma DRAM that put a lot of emphasis on reduced power consumption, Micron Technology unveiled its 128GB small outline compression attached memory module (SOCAMM).
Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK™ Drive G2 automotive power module.
As part of the program announced in October 2024, STMicroelectronics of Geneva, Switzerland has disclosed further plans to reshape its global manufacturing footprint that will “future proof our integrated device manufacturer model with strategic
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TE Connectivity (TE) draw wire position sensors have proven their reliability in automation, commercial vehicle, medical, and test and measurement applications. They are easy to install and are primarily used in applications requiring 2 to 1,700 in. (50 to 43,000 m)